ABOUT US

DiamNEX is a high-tech enterprise focusing on the research and development, production and commercialization of diamond thin film materials. DiamNEX's unique production technology has successfully broken through the bottleneck in the preparation of large-size, high-quality, and transferable diamond thin films, providing a brand-new solution for the large-scale commercial production of diamond semiconductor materials.

We employ "Edge-Exposed Exfoliation" groundbreaking global-first technology, which revolutionizes material processing bypassing traditional steps such as cutting, etching, and polishing. We have successfully produced wafer-size (2 to 4 inch and scalable), ultra-flat (sub-nanometer surface roughness), and ultra-thin (sub-micron) polycrystalline diamond films. They are also transferable and bendable, and have the potential for commercialization in a variety of fields.

Unlike the industry's mainstream approach to rigid wafers, we have chosen to differentiate ourselves by focusing on rigid films, which gives us a significant advantage in terms of lowering our costs of growth and improving manufacturing efficiency. The wide range of applications for rigid polymer films gives us an advantage in downstream applications.